Senior Researcher I – Advanced Packaging Simulation and Modelling
Cork, Ireland
Full Time
Research
Experienced
Senior Researcher I – Advanced Packaging Simulation and Modelling
About Tyndall
Tyndall National Institute is an international leader in semiconductors, photonics and deep-tech research and innovation. As a leading collaborative European research institute, Tyndall is a key actor and hosting partner in the delivery of the ‘Chips for Europe Initiative’ (EU Chips Act).
Tyndall is Ireland’s leading research and innovation organisation and it is the national focal point for excellence in deep-tech research, development and graduate training at the convergence of nanotechnology, microelectronics, photonics, electronics and AI. Tyndall is recognised as an international research leader in semiconductor, chip and digital technologies, particularly as applied to the fields of Information & Communications, Health & Life Sciences, Agritech & Food Security, Energy and Climate Mitigation, emerging fields such as quantum, and novel computing paradigms.
The Institute’s key objective is to see frontier research activities having a significant impact on economic development and societal challenges in Ireland, Europe and beyond. Central to Tyndall’s mission is delivering economic impact through research excellence in partnership with industry and academia. With an annual turnover of more than €50m, the Institute has a community of over 600 researchers, engineers, support staff, postgraduate students, interns and industry researchers-in-residence.
With significant committed Irish government support, Tyndall will grow to be 1,000 people by 2030, with approximately 750 researchers, including 250 PhD students. A new 17,000 m2 research building is under development adjacent to the Cork headquarters and there are developing plans to expand Tyndall’s existing Dublin research labs and to establish other research sites within Ireland.
Tyndall’s expansion is also supported by recent national and EU funding wins for significant (M€10’s) additional research equipment across a range of areas such as semiconductor processing, microscopy, quantum technologies, heterogeneous integration, ultra-high speed optical communications and RF through THz characterisation.
Role Description
The Photonics Packaging and Systems Integration Group at Tyndall National Institute invites applications for the position of Senior Researcher I – Advanced Packaging Simulation and Modelling.
This role will contribute to the development of advanced packaging technologies for next-generation photonic and electronic systems, with a particular focus on simulation and modelling activities supporting the development of scalable packaging solutions and pilot line activities within PIXEurope. The successful candidate will develop and apply modelling methodologies to support the design, optimisation and experimental validation of packaging technologies, components and integrated systems.
A key objective of the role will be to develop broader multiphysics modelling capabilities within the group, building from electrical and electromagnetic modelling towards the integration of thermal, mechanical and optical considerations where appropriate. The role will also develop cost and techno-economic modelling approaches to support the assessment of packaging processes, manufacturing scalability and technology trade-offs.
The successful candidate will work closely with researchers and engineers across the group to identify modelling requirements, correlate models with experimental results and develop modelling methodologies that can be applied across research, pilot line and technology development activities. The role will contribute to PIXEurope and other strategic research programmes, support the development of research proposals and help establish a broader simulation and modelling capability within the group.
Key Responsibilities
Reporting to the Head of the Photonics Packaging and Systems Integration Group, the Senior Researcher will:
Apart from offering a position in a very successful and positive research environment, with a collaborative ethos full of diverse competencies to boost your career, we offer the following:
Contract Category: Full-Time
Contract Type: Fixed Term
Appointment may be made on the Admin III Grade 6 Scale B (new entrants) salary €61,471 - €73,392 per annum. Salary placement on appointment will be in accordance with the public sector pay policy.
Informal enquiries can be made in confidence to Dr Padraic Morrissey.
Closing date for applications for this position is 1pm, 11th December 2026
Application Instructions
Please make sure to attach an up-to-date CV/Resume AND a brief motivation letter outlining how you meet the ‘Essential Criteria’ for this role.
A full candidate information pack is available to download by clicking here.
Please note that Garda vetting and/or an international police clearance check may form part of the selection process.
Please note that an appointment to posts advertised will be dependent on university approval, together with the terms of the employment control framework for the higher education sector.
Tyndall National Institute does not require the assistance of recruitment agencies.
Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.
About Tyndall
Tyndall National Institute is an international leader in semiconductors, photonics and deep-tech research and innovation. As a leading collaborative European research institute, Tyndall is a key actor and hosting partner in the delivery of the ‘Chips for Europe Initiative’ (EU Chips Act).
Tyndall is Ireland’s leading research and innovation organisation and it is the national focal point for excellence in deep-tech research, development and graduate training at the convergence of nanotechnology, microelectronics, photonics, electronics and AI. Tyndall is recognised as an international research leader in semiconductor, chip and digital technologies, particularly as applied to the fields of Information & Communications, Health & Life Sciences, Agritech & Food Security, Energy and Climate Mitigation, emerging fields such as quantum, and novel computing paradigms.
The Institute’s key objective is to see frontier research activities having a significant impact on economic development and societal challenges in Ireland, Europe and beyond. Central to Tyndall’s mission is delivering economic impact through research excellence in partnership with industry and academia. With an annual turnover of more than €50m, the Institute has a community of over 600 researchers, engineers, support staff, postgraduate students, interns and industry researchers-in-residence.
With significant committed Irish government support, Tyndall will grow to be 1,000 people by 2030, with approximately 750 researchers, including 250 PhD students. A new 17,000 m2 research building is under development adjacent to the Cork headquarters and there are developing plans to expand Tyndall’s existing Dublin research labs and to establish other research sites within Ireland.
Tyndall’s expansion is also supported by recent national and EU funding wins for significant (M€10’s) additional research equipment across a range of areas such as semiconductor processing, microscopy, quantum technologies, heterogeneous integration, ultra-high speed optical communications and RF through THz characterisation.
Role Description
The Photonics Packaging and Systems Integration Group at Tyndall National Institute invites applications for the position of Senior Researcher I – Advanced Packaging Simulation and Modelling.
This role will contribute to the development of advanced packaging technologies for next-generation photonic and electronic systems, with a particular focus on simulation and modelling activities supporting the development of scalable packaging solutions and pilot line activities within PIXEurope. The successful candidate will develop and apply modelling methodologies to support the design, optimisation and experimental validation of packaging technologies, components and integrated systems.
A key objective of the role will be to develop broader multiphysics modelling capabilities within the group, building from electrical and electromagnetic modelling towards the integration of thermal, mechanical and optical considerations where appropriate. The role will also develop cost and techno-economic modelling approaches to support the assessment of packaging processes, manufacturing scalability and technology trade-offs.
The successful candidate will work closely with researchers and engineers across the group to identify modelling requirements, correlate models with experimental results and develop modelling methodologies that can be applied across research, pilot line and technology development activities. The role will contribute to PIXEurope and other strategic research programmes, support the development of research proposals and help establish a broader simulation and modelling capability within the group.
Key Responsibilities
Reporting to the Head of the Photonics Packaging and Systems Integration Group, the Senior Researcher will:
- Develop and apply simulation and modelling approaches for advanced photonic and electronic packaging technologies, with particular emphasis on electrical and electromagnetic modelling.
- Develop multiphysics modelling approaches incorporating electrical, electromagnetic, thermal, mechanical and optical effects as appropriate to the application.
- Support the design and optimisation of packaging technologies, components and integrated systems through modelling, simulation and experimental validation.
- Develop cost and techno-economic modelling approaches to assess packaging processes, manufacturing scalability and technology trade-offs.
- Work closely with researchers and engineers to identify modelling requirements, correlate simulation with experimental results and integrate modelling into technology and process development activities.
- Develop reusable modelling methodologies and workflows that can support research projects, PIXEurope pilot line activities and future packaging technologies.
- Lead technical work packages and joint research activities, coordinating with researchers, engineers and project partners to ensure delivery of project objectives, milestones and technical outputs.
- Contribute to the development of research proposals, funding applications and new research opportunities, including assisting with the formation of academic and industry partnerships.
- Support the development of the group's simulation and modelling capability, including mentoring postgraduate students, researchers and early-career staff where appropriate.
- Ensure compliance with Tyndall's Quality Management System, Health and Safety standards and other relevant regulations.
- To carry out any additional duties, such as general group activities, administrative tasks or Education and Public Engagement activities, that may reasonably be required within the general scope and level of the post.
- PhD qualification in Electrical Engineering, Electronic Engineering, Physics, Photonics or a closely related discipline.
- Typically, 6 years' academic or relevant industrial R&D experience.
- Strong experience in the design, simulation and modelling of electronic devices, components, subsystems or integrated systems.
- Strong experience in electrical and/or electromagnetic modelling and simulation.
- Experience using commercial or research simulation tools for electromagnetic, electrical, thermal or multiphysics modelling.
- Experience combining modelling and simulation with experimental characterisation or validation.
- Experience contributing to research proposals, funding applications or the development of new research opportunities.
- Demonstrated ability to lead technical research activities and work widely with researchers, engineers and academic or industrial partners.
- Strong communication and technical report-writing skills, including experience presenting and/or publishing technical or research results.
- Experience in advanced electronic or photonic packaging technologies, including 2.5D or 3D integration approaches.
- Experience with multiphysics modelling, including coupled electrical, electromagnetic, thermal, mechanical or optical simulation.
- Experience developing models or simulation methodologies to support packaging process development, optimisation or manufacturing.
- Experience in cost modelling, techno-economic analysis, manufacturing cost assessment or related approaches.
- Experience with RF, microwave or high-frequency electronic systems and their packaging and integration.
- Experience participating in national, European or industrially funded research programmes and contributing to research proposals.
- Experience of international contributions, such as invited presentations, conference organisation or postgraduate examination.
- Experience supervising students or mentoring early-career researchers.
Apart from offering a position in a very successful and positive research environment, with a collaborative ethos full of diverse competencies to boost your career, we offer the following:
- Impactful Work: Opportunities to contribute to ground-breaking research and innovation that shape Ireland’s economy and the society at large.
- Continuous Learning: Strong support for formal training, further study and professional development.
- Interdisciplinary Environment: Where academia, industry, and innovation intersect - supported by cutting-edge infrastructure and expert knowledge.
- Blended Working: Flexibility to work remotely and on-site, where the role allows.
- Comprehensive Benefits: Access to UCC pension, long-term illness benefit, life assurance, and more.
- Generous Leave: Competitive annual leave entitlements.
- Equity & Inclusion: Athena Swan Bronze award holder, with ongoing initiatives led by a dedicated People and Culture team to ensure equity for all.
- Core Values: A culture grounded in Ambition, Collaboration, Diversity, Excellence, and Integrity.
- Entrepreneurial Spirit: A proactive, innovation-driven environment that welcomes entrepreneurial and creative thinkers, including those with start-up experience.
- Supportive Onboarding: Structured induction and mentoring to help new hires integrate and thrive.
- Vibrant Culture: A collaborative, people-first workplace with a strong sense of community.
Contract Category: Full-Time
Contract Type: Fixed Term
Appointment may be made on the Admin III Grade 6 Scale B (new entrants) salary €61,471 - €73,392 per annum. Salary placement on appointment will be in accordance with the public sector pay policy.
Informal enquiries can be made in confidence to Dr Padraic Morrissey.
Closing date for applications for this position is 1pm, 11th December 2026
Application Instructions
Please make sure to attach an up-to-date CV/Resume AND a brief motivation letter outlining how you meet the ‘Essential Criteria’ for this role.
A full candidate information pack is available to download by clicking here.
Please note that Garda vetting and/or an international police clearance check may form part of the selection process.
Please note that an appointment to posts advertised will be dependent on university approval, together with the terms of the employment control framework for the higher education sector.
Tyndall National Institute does not require the assistance of recruitment agencies.
Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.
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